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  • Black & Opaque High Modulus Polyimide film - for Mechanical Stability, Light Blocking, and Electrical Insulation
HomeProductsPolyimide FilmHigh Modulus Polyimide FilmBlack & Opaque High Modulus Polyimide film - for Mechanical Stability, Light Blocking, and Electrical Insulation

Black & Opaque High Modulus Polyimide film - for Mechanical Stability, Light Blocking, and Electrical Insulation

PAB

Black High Modulus Polyimide Film (PAB) - for Mechanical Stability, Light Blocking, and Electrical Insulation


Product Description: 

Black High Modulus Polyimide Film PAB is a black and opaque polyimide film engineered for applications requiring exceptional dimensional stability, high mechanical rigidity, and ultra-low light leakage. Compared to the standard black PI films, PAB delivers superior stiffness while retaining the thermal stability, chemical resistance, and electrical insulation of conventional PI films. 

 

Its uniform black appearance and high modulus provide effective light blocking and superior stiffness, making PAB ideal for optical shielding and high-density electronic designs. 


Combining mechanical strength, thermal stability, and electrical insulation, PAB is well-suited for F-PCB substrates, motor insulation, aerospace applications, and other precision-critical applications. 



High Modulus Black PI Film for optical and display modules, highlighting alignment stability and structural performance.



Key Properties and Benefits:


  1. High Modulus ≥ 5 GPa : For improving structural rigidity.
  2. Extra-Low light leakage ≤ 0~0.1%: Effective light blocking for optical and fine-pitch designs.
  3. Excellent dimensional stability ≤ 0.1% : Maintains shape under thermal and mechanical stress.
  4. Outstanding electrical insulation: Ensures reliable electrical performance.
  5. Uniform Black Appearance: Consistent color and functional performance.
  6. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
  7. UL 94 V-0 , VTM-0 Certified.



Design Challenges in Structural & Optical Systems:

   

Engineers specifying black PI films for structural and light blocking purposes frequently encounter:           

  • Insufficient stiffness leading to deformation or misalignment

  • Non-uniform black surfaces causing inconsistent light absorption

  • Light leakage at mechanically stressed regions

  • Electrical insulation degradation under mechanical load

  • Trade-offs between rigidity, opacity, and dielectric reliability

 In practice, optical performance and electrical safety are often compromised by mechanical instability, not material thickness alone.



Our Black High Modulus PI Film (PAB) Approach:


PAB is engineered as a structural-grade black polyimide film, addressing mechanical, optical, and electrical requirements simultaneously, featuring:

  • High modulus PI structure
    Providing mechanical rigidity and dimensional stability under stress

  • Uniform black and fully opaque surface
    Ensuring consistent light blocking and minimizing stray light reflection

  • High dielectric strength
    Maintaining electrical insulation even in mechanically loaded conditions

  • Stable PI matrix
    Preserving mechanical and optical performance under thermal and environmental cycling

Unlike generic black PI films or coated solutions, PAB is designed to function as a mechanically defined layer, not just an optical coating.



How PAB Fits into System Design


Our black high modulus PI film PAB is typically integrated as:

  • A structural light-blocking layer in sensor and camera modules

  • A mechanical reinforcement and optical isolation layer in precision assemblies

  • A rigid insulating film where dimensional stability and electrical safety are critical

By combining high modulus, complete opacity, and strong insulation in one film, PAB reduces the need for additional stiffeners or secondary shielding layers.


Available Sizes:     

  •     Film Thickness:  25µm, 50µm, 75µm, 100µm, 125µm
  •     Roll Width: 250mm, 520mm




Typical Applications:

  1. Sensor & Camera Modules (ADAS / Imaging Systems)
  2. FPC / COF Structures with Local Reinforcement & Light Blocking
  3. Precision Optical Assemblies
  4. Precision Electronic Modules Requiring Dimensional Control
  5. Opaque cover-layers, Satellite blankets, Radiant heat absorber
  6. Optical & Electrical Isolation Layers in Compact Assemblies



Application Case: 

I. Control Stray Light for Smartphone Camera VCM


Infographic showing black high-modulus PI components applied in a smartphone camera VCM for light shielding, insulation, reinforcement, and light leakage control.


Precision-engineered black high-modulus PI components designed for smartphone camera VCM, enabling effective stray light suppression, electrical insulation, and structural stability to enhance overall imaging performance.





Designing systems that require mechanical rigidity, complete light blocking, and reliable electrical insulation?


Contact us to discuss Black & Opaque High Modulus Polyimide Film (PAB) solutions optimized for your mechanical stability, optical control, and insulation requirements.




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