Ultra-High Thermal Conductivity Polyimide Pad (TID)- for efficient heat transfer, stable performance

Ultra-High Thermal Conductivity Polyimide Pad  (TID) - Engineered for Efficient Heat Transfer, and Electrical Insulation

Product Description: 

Ultra-High Thermal Conductivity Polyimide Pad (TID) is a high-performance thermal interface and electrical insulation solution engineered for demanding compact, high-power-density applications. It delivers low interface resistance, high heat transfer, and excellent dielectric strength to ensure stable and reliable operation under high voltage and high temperature conditions.

TID is constructed using our ultra high thermally conductive polyimide film as the basic carrier laminated with a thin high thermally conductive PSA layer. TID enables efficient heat transfer across interfaces while maintaining electrical insulation, mechanical compliance, and long-term reliability.

By combining high thermal conductivity with robust electrical insulation, TID ensures reliable insulation coverage, stable thermal transfer, and long-term reliability in UAV PDB System, Automotive ADAS, LCD Display COF IC, Smartphone & Tabelt PC, EV battery BMS, and Robot AI Processing unit or Drivers. TID delivers a balanced solution for both thermal performance and integration flexibility.

Key Proterties and Benefits: 

1. Low Interface Thermal Resistance                                                                                                                                                          Minimizes thermal bottlenecks between heat sources and heat sinks.
2. Ultra-High Thermal Conductivity in Z direction (>0.8 W/m·K)                                                                                                                Enhances heat transfer efficiency across critical interfaces.
3. Excellent Electrical Insulation & High Dielectric Strength (>120KV/mm)                                                                                    Ultra-high dielectric strength ensures reliable electrical isolation under high voltage, preventing leakage, breakdown, and short circuits.
4. Strong Bonding Strength & Conformability                                                                                                                                            Improves surface wet-out and reduces air gaps.
5. Ultra-Thin, Lightweight Structure                                                                                                                                                              Ideal for space-constrained designs.
6. Reliable Performance                                                                                                                                                                      Stable across thermal cycling and long-term operation.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.

Thermal PI Pad (TID) Structure: 

Available Sizes & Shapes: 

• Thickness: Thermal conductivity PI film (25µm, 38µm, 50µm, 75µm), Thermal conductivity PSA adhesive (10µm to 50 μm)
• Sizes and Shapes: Die-cut into custom sizes and patterns for specific applications
• Available in sheets, rolls, or pre-cut pads
• Compatible with complex geometries and multi-component assemblies

Design Challenges in High-Power Density Applications:

High-power density electronics generate significant heat while requiring strict electrical isolation. Designers must balance thermal performance, insulation reliability, and mechanical stability within limited space and tight tolerances.

Key challenges include:

• High power density leading to localized hotspots

• Electrical isolation vs. heat dissipation trade-off

• Interface gaps causing thermal resistance

• Limited space restricting traditional cooling solutions

• Long-term reliability under thermal cycling and mechanical stress

In many cases, thermal performance issues originate not from the heat source itself, but from improper interface material behavior or dimensional mismatch.

Our Thermal PI Pad (TID) Approach: 

Our TID solutions are engineered with equal emphasis on thermal performance, and electrical safety, featuring:

• Hybrid material design
  Combining film-based heat spreading and adhesive interface coupling

• High dielectric insulation performance
  Supporting safe operation in power and high-voltage environments

• Optimized interface contact                                                                                                                                                          Reduce thermal resistance and Optimize heat flow paths through interface 

• Design flexibility  
  Enabling easy integration into complex assemblies

Unlike generic thermal pads, TID is designed as an efficient interface component, not just a filler layer.

When to choose PI pad (TID) vs Silicone pad

Application-based comparison of PI pad (TID) and silicone pad for thermal interface design. While silicone pads offer higher compressibility and broader material options, PI pads are optimized for ultra-thin interfaces, optical cleanliness, and stable performance in compact, high-density optical modules.

Typical Applications: 

1. Consumer electronics (smartphones, laptops, tablets)                                                                                                                        Thermal and electrical interface between power source substrate and heatsink
2. High-Power MOSFET & IGBT Devices                                                                                                                                            Insulation pads for reliable heat dissipation and electrical isolation
3. Power Conversion Systems                                                                                                                                                        Inverters, converters, and power control units requiring stable thermal management
4. EV Battery BMS                                                                                                                                                                              Electrical insulation and localized heat management for stable and reliable BMS operation
5. Industrial Power Electronics                                                                                                                                                             High-current systems demanding efficient heat transfer and long-term reliability
6. LED & High-Power Lighting Modules                                                                                                                                          Thermal interface for heat-sensitive components
7. Telecom & networking equipment

Application Cases: 

I. High Thermal Conductivity Polyimide Pad (TID) for LCD Display COF IC

A high-performance polyimide interface pad designed to efficiently transfer heat from COF IC to the LCD panel or metal frame. By reducing thermal resistance and improving heat dissipation, TID enhances display stability, lowers operating temperature, and improves long-term reliability in compact LCD modules.

II.  High Thermally Conductive PI Pad (TID) for Optical Transceiver Modules

An ultra-thin, high thermal conductivity polyimide interface pad designed to efficiently transfer heat from critical components such as DSP IC, TOSA, and ROSA to the module housing. By minimizing interface thermal resistance and eliminating silicone-related contamination risks, TID ensures stable optical performance, improved reliability, and effective thermal management in compact optical transceiver modules.

III. High Thermal Conductivity PI Pad (TID) for  Camera/Vision/Optical Modules

The TID (Thermal Interface PI Pad) enhances heat transfer from sensors and processors in camera modules, reducing thermal hotspots and noise to ensure stable imaging performance. Its ultra-thin polyimide structure enables compact design while delivering reliable, clean, and efficient thermal management.

Designing products requiring both high thermal conductivity and electrical insulation?

Contact us to discuss  High Thermally Conductive PI Pad (TID) solutions tailored to your thermal load, insulation requirements, and assembly constraints.