Black PI Stiffener (BPS) - Light Shielding & Structural Integration Solution for Advanced FPC Modules
Product Description:
Black Polyimide Stiffener BPS is made from our black & opaque polyimide film (or matte type) and a high bonding strength PSA, then die-cut with high-accuracy punching equipment to ensure consistent dimensions and burr-free edges. a high-reliability reinforcement material engineered to increase localized thickness, rigidity, and mechanical stability in flexible electronic assemblies.
Designed for applications requiring both structural reinforcement and light blocking. Unlike conventional amber PI stiffeners used only for mechanical support, BPS delivers multi-functional integration—combining reinforcement, adhesion, and optical shielding into a single material solution.
The uniform black PI layer also provides light-blocking capability and visual consistency, making it ideal for display and optoelectronic modules. It has become an essential design component for modern camera modules, display assemblies, and high-density FPC designs, where space, reliability, and appearance are all critical.applications.
Key Features & Properties:
High Peel Strength: 6~8N/10mm, 90° peeling test (to PI Film).
- Stable Acrylic Adhesive: Superior aging resistance vs. silicone adhesives.
- Excellent Light Shielding (light transmittance 0%) : Prevents light leakage in optical modules.
- Low Reflectivity (Anti-Reflection) : Minimizes internal reflections, flare, and ghosting effects.
- High Contrast Enhancement : Reduces light bleeding and halo effects in display systems.
- Thermal & Mechanical Stability : Excellent heat resistance and dimensional stability.
- Process-friendly: Suitable for die-cutting, lamination, and mass production.
- Precision Die-Cutting: Custom shapes and tight tolerances for exact designs.
- Dual Functionality: Combines stiffener and functional tape into one material.
- RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
Design Challenges in Modern Electronic Devices
Modern electronic modules face multiple challenges:
Light leakage affecting camera and sensor performance
Multiple materials required (stiffener + tape + shielding layer)
Visual inconsistency in high-end devices
Limited space in compact module designs
Traditional solutions require multiple components, increasing complexity, thickness, and cost.
Our Black PI Stiffener (BPS) Approach
Our BPS simplifies module design by integrating multiple functions into one material: :
Reinforcement + Adhesion + Light Blocking in one layer
Reduced material stack-up
Improved assembly efficiency
Enhanced long-term reliability
From multi-layer complexity → to single-material solution
BPS Structure:
Top Layer: Black & Opaque Polyimide film or Black Thermal Conductivity PI Film (2mil~7mil)
Middle Layer: Acrylic Pressure Sensitive Adhesive (10µm~60µm), with/without thermal conductivity
Bottom Layer: Transperant PET Liner (50µm~75µm)
Light Blocking (Opaque Black) Structural Reinforcement Long-term Adhesion Stability Heat Resistant (PI base)
✂️ Precision Die-cut Ready Low Outgassing / Clean
Available Sizes and Shapes:
Thickness: Black & Opaque (or Matte type) PI film (25µm to 125µm) , High Bonding Strength PSA adhesive (25µm to 60 μm)
Sizes and Shapes: Die-cut into custom sizes and patterns for specific applications
Available in sheets, rolls, or pre-cut pads
Compatible with complex geometries and multi-component assemblies
Why Choose Black PI Stiffener in Optical Applications
Black PI vs. Amber PI Stiffener – Optical Performance Comparison for Advanced Electronics
Black PI stiffeners provide superior light blocking, low reflectivity, and high-contrast performance, making them essential for camera modules, display systems, and other light-sensitive applications. In contrast, amber PI stiffeners are suitable for general reinforcement but allow light transmission and higher reflection, which may impact optical performance.
Typical Applications:
Camera module (light shielding + reinforcement)
- Display module assembly
- Automotive Optical sensor integration
- Optical & Sensing Devices
- Premium Consumer Electronics
- FPC Reinforcement (Optical-Sensitive Areas)
- Foldable device internal modules
Application Case:
I. Black PI Stiffener (BPS) for Optical-Precision Applications
Designed for light-sensitive and high-performance electronics, Black PI Stiffener (BPS) enhances optical clarity, suppresses internal reflection, and ensures stable performance in camera and display modules.
Looking to simplify your module design?
Contact us to discuss how PI Stiffener (BPS) solutions can replace multiple materials and improve your product performance.
Custom thickness / die-cut / application support available
Contact us today for samples and technical consultation.
