PI-Derived Synthetic Graphite Sheet - for Efficient Heat Spreading in Space-Constrained Designs

PI-Derived Synthetic Graphite Sheet (MGS) - Engineered for Efficient Heat Spreading in Space-Constrained Designs

Product Description: 

Our PI-Derived Synthetic Graphite Sheet MGS is a high-performance, ultra-thin thermal spreading material engineered from our high performance polyimide film through advanced high-temperature carbonization and graphitization processes.

By precisely controlling the sintering and graphitization conditions, MGS forms a highly oriented lamellar graphite lattice structure, enabling exceptional in-plane (X–Y) thermal conductivity. This structure allows heat to be rapidly and uniformly distributed across the surface, effectively reducing localized hot spots in compact electronic assemblies.

MGS combines ultra-high thermal conductivity, low thermal resistance, flexibility, and lightweight characteristics, making it an ideal solution for next-generation thermal management applications where space, weight, and mechanical compliance are critical. 

Key Properties and Benefits:

1. Ultra-high in-plane thermal conductivity in x-y direction: 1300–1600 W/m·K
2. Low thermal resistance with efficient heat spreading performance.
3. Ultra-thin (0.023mm to 0.05mm), lightweight, flexible, and bendable for flat or curved surfaces.
4. Excellent thermal stability, mechanical strength, and chemical resistance.
5. EMI shielding capability, suitable for multifunctional thermal designs.
6. Environmentally friendly material with low mass density.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.

Available Sizes: 

Thickness: 23µm, 32µm, 45µm, 50µm

Width: 140mm/280mm/ Custom sizes available

Engineering Challenges in Thermal Spreading Design: 

Engineers working on compact and high-power assemblies commonly face:

• Localized hot spots near ICs, power devices, or LEDs

• Limited vertical space preventing thicker heat sinks

• Inefficient heat distribution causing temperature gradients

• Trade-offs between thermal performance and mechanical flexibility

• Inconsistent thermal behavior across different product areas

In many cases, heat exists—but has nowhere to go laterally.

Our Solution Approach: 

MGS is engineered as a functional heat-spreading layer, derived from polyimide to ensure structural consistency and process stability, featuring:

• Ultra-high in-plane thermal conductivity
  Rapidly spreading heat across the surface to reduce hot spots

• Low through-plane thermal resistance
  Supporting integration with interface materials and heat sinks

• PI-derived structure for dimensional and thermal stability
  Maintaining performance under thermal cycling and long-term operation

• Thin, lightweight, and flexible form factor
  Enabling integration in space-constrained and compact designs

Unlike generic graphite materials, MGS is designed to behave as a predictable and controllable thermal layer within electronic assemblies.

How MGS Fits into the Thermal Architecture

MGS is not intended to replace thermal interface materials or heat sinks.
Instead, it works in combination with them:

• MGS → spreads heat laterally

• TIS / TIM → conducts heat vertically

• Heat sink / chassis → dissipates heat to the environment

This layered approach allows engineers to separate heat spreading from heat dissipation, optimizing each function independently.

Why Choose PI-Derived Synthetic Graphite Sheet (MGS)?

Engineered vs. Natural: Choosing the Right Graphite for Thermal Performance

A side-by-side comparison of synthetic (MGS) and natural graphite sheets, highlighting key differences in thermal conductivity, thickness capability, flexibility, cleanliness, and cost—helping engineers select the right material based on design priorities.

Typical Applications: 

1. Smartphones, laptops, tablets, AR/VR, and wearable electronics.
2. High-power ICs, CPUs, MOSFETs, memory modules, and motherboards. 
3. UAV PDB system.
4. 5G / 6G network systems and communication equipment.
5. Industrial PCs and high-power density electronic systems.
6. EV/HEV IVI, ADAS, and Battery BMS.
7. High-performance power modules and diagnostic instruments.  .
8. Thin TVs, projectors, micro LED substrates, and display panels (LCD / OLED).

Application Cases: 

I. Spread Heat in 5G Smartphone/Tablet PC Devices

MGS (Synthetic Graphite Sheet) rapidly spreads heat across high-density smartphone and tablet layouts, eliminating hotspots and ensuring stable performance in ultra-thin 5G devices.

II. MGS Synthetic Graphite TIM Solution for High-Power CPU, GPU & IC

MGS Synthetic Graphite Sheet can function as a direct thermal interface and heat-spreading layer between high-power CPU, GPU or IC devices and the heat sink, providing efficient in-plane heat spreading while minimizing additional interface layers.

III. MGS Synthetic Graphite Sheet for 5G / RF IC Thermal Management

MGS Synthetic Graphite Sheet enables rapid in-plane heat spreading from localized RF IC and power amplifier (PA) hotspots, helping distribute heat across a larger area for 5G and mmWave thermal management.

IV. Eliminate Hotspots in UAV/Drone PDB Systems

MGS (Synthetic Graphite Sheet) rapidly spreads heat across high-power PDB layouts, eliminating hotspots, reducing peak temperature, and improving system reliability in space-constrained drone platforms.

Designing products with localized hot spots and limited thermal headroom?

Contact us to discuss PI-Derived Synthetic Graphite Sheet (MGS) solutions optimized for your thermal layout, space constraints, and reliability requirements.