Ultra-Stabe Polyimide Film – for High Dimensional Accuracy and Precision Applications

High Dimensional Stability Polyimide film PIN - for Precision Applications

Product Description:

PIN is an advanced, next-generation low heat shrinkage polyimide film developed as an enhanced grade of our standard series. It is specifically engineered to deliver superior dimensional stability, reduced heat shrinkage, and enhanced mechanical strength, ensuring reliable in applications where precision, durability, and long-term stability are critical.

Designed for high-temperature environments, PIN exhibits outstanding physical, chemical, and electrical properties across an exceptionally wide operating temperature range—from −452°F (−269°C) to +500°F (+260°C), with short-term thermal resistance up to +752°F (+400°C).

With balanced mechanical strength in both the machine direction (MD) and transverse direction (TD) , PIN minimizes dimensional variation and maintains consistent performance even under extreme thermal and mechanical stress. 

These characteristics make PIN an ideal material for high-precision electronic, electrical, and industrial applications that demand tight tolerance, durability, and long-term stability.

Design Challenge:

In high-density and fine-pitch electronic assemblies, conventional polymer films often suffer from dimensional instability during thermal processing, chemical etching, lamination, or long-term operation. 

Thermal expansion, shrinkage, and moisture-induced deformation can lead to misalignment, circuit distortion, and yield loss particularly in applications such as COF, FPC fine-pitch bonding, and high-precision semiconductor packaging.

Our Solution:

PIN High Dimensional Stability Polyimide Film is engineered to maintain exceptional dimensional accuracy under thermal, mechanical, and environmental stress.

Through optimized polymer backbone design and tightly controlled film manufacturing processes, PIN delivers low dimensional change, ensuring stable registration, structural integrity, and process reliability throughout downstream manufacturing and end-use conditions.

Why Dimensional Stability makes PIN work:

Dimensional Stability Makes the Difference through Thermal Cycling

Comparison of dimensional behavior between conventional PI film and PIN under thermal processing and repeated thermal cycling. PIN maintains stable geometry and registration, reducing yield risk and minimizing cumulative shrinkage across multiple thermal cycles. This stability ensures consistent process control and higher long-term yield in precision electronic manufacturing.

Key Features & Performance:

1. High dimensional stability & low CTE ensuring stable geometry during high-temperature processing & reflow.
2. Minimal shrinkage < ±0.1%  over repeated thermal cycles.
3. Stable registration through multi-step processing.
4. Reliable performance in long-term thermal aging.
5. Well-balanced mechanical strengthin both MD & TD directions.
6. High Dielectric Strength ≥160KV/mm : Excellent electrical insulation.
7. Superior radiation resistance.
8. Excellent mechanical strength.
9. High Thermal & Chemical Resistance for Manufacturing Reliability. 
10. Outstanding durability and long-term reliability in harsh environments.
11. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
12. UL 94 V-0 , VTM-0 Certified.

Available Sizes:

Film Thickness:  25µm, 50µm, 75µm, 100µm

Roll Width: 520mm, 1040mm

Typical Applications:

1. Electromagnetic wire insulation and cable coiling.
2. High-precision films for membranes, biosensors and diagnostic devices.
3. Reinforcement and insulation layers in microelectronics.
4. Motor slot liners and electrical insulation components. 
5. Transformer & Converter interlayer insulation.
6. Reinforcement for LCD Display driver IC COF and fine-pitch bonding.
7. Dimensional stable base layer for optical components requiring low shrinkage.
8. EV Batery cell and inter-cell insulation and wrapping.

Application Cases: 

I. High-Precision Pressure Sensing enabled by PIN

Dimensional stability PI Film PIN enhances pressure sensor accuracy by minimizing thermal deformation, reducing signal drift, and maintaining reliable performance under demanding conditions.

Designing high precision devices that require dimensional stability polyimide insulation?

Contact us to discuss High Dimensional Stability Polyimide Film (PIN) solutions aligned with your insulation requirements, mechanical needs, and production objectives.