Ultra-High Modulus & Ultra-Low CTE Polyimide Film - for Extreme Dimensional Stability in Precision Applications

Ultra-High Modulus & Ultra-Low CTE Polyimide Film (PIU) - for Extreme Dimensional Stability in Ultra-High Precision Applications

Product Description:

PIU (Ultra-High Modulus & Ultra-Low CTE Polyimide Film) is engineered specifically for high-precision applications where dimensional stability and signal accuracy are critical. Its unique combination of high stiffness and low thermal expansion enables faithful strain transfer  while significantly reducing thermal-induced measurement drift.

Designed for demanding environments, PIU film maintains geometry, alignment, and positional stability across temperature variations and processing cycles. It is ideally suited for precision instrumentation, EV battery sensing, semiconductor metrology, and other advanced applications requiring reliable and repeatable measurement performance.

Key Features and Benefits:

1. Perfect Dimensional Stability: Maintains shape under thermal cycling.
2. Ultra High Modulus ≥ 7 GPa: Reinforces fine-pitch structures without warping.
3. Ultra Low Coefficient of Thermal Expansion (CTE ≤ 17 ppm/°C): Reduces mismatch with copper traces.
4. High Temperature Resistance: Reliable up to demanding operating conditions.
5. Excellent Electrical Insulation: Safe for sensitive electronic components.
6. Outstanding Durability & Reliability: Long-term performance for high precision sensor modules and high-density fine pitch FPCs.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
8. UL 94 V-0 , VTM-0 Certified. 

Design Challenges in High Precision Measurement Systems

Engineers working on high-precision measurement systems commonly face:

• Thermal-Induced Measurement Drift : Temperature variations cause expansion mismatch between materials, leading to signal drift and measurement error.

• Strain Transfer Loss : Conventional substrates absorb or dampen strain, resulting in reduced sensitivity and inaccurate readings.aaaaa

• Long-Term Stability & Repeatability : Measurement systems often suffer from signal instability over time due to material creep, relaxation, or environmental exposure.

• Alignment & Positional Deviation : In high-precision systems, even minor dimensional changes can affect alignment, leading to cumulative measurement inaccuracies.

• Harsh Operating Conditions : Thermal cycling, humidity, and mechanical stress can degrade performance and compromise measurement reliability.

  
  

In many cases, system accuracy degrades not because of electrical failure, but due to micron-level dimensional changes.

Our PIU Film Approach

Our ultra-high modulus & ultra-low CTE PI Film PIU is engineered as a dimension-control PI film, designed to minimize mechanical and thermal deformation, featuring:

• Minimized Thermal Drift
  Ultra-low CTE reduces expansion mismatch, ensuring stable signals across temperature variations.

• Accurate Strain Transfer
  Ultra-high modulus enables faithful transmission of strain without damping or distortion.

• Superior Dimensional Stability
  Maintains geometry, alignment, and positional integrity under thermal and mechanical stress.

• High Reliability in Harsh Environments
  Polyimide-based structure provides excellent thermal resistance and environmental durability.

• Consistent & Repeatable Measurement Performance
  Supports long-term stability, enabling reliable and reproducible data in precision systems.

Unlike general-purpose polyimide films, PIU is designed to function as a precision structural substrate, not merely a flexible insulating layer.

Available Sizes:

 Film Thickness: 50µm,75µm

 Roll Width: 520mm, 1040mm

 Optional surface treatments can be provided to meet specific downstream processing or application requirements.

Typical Applications:

1. Fine-Pitch FPC & High-Density Interconnect Structures
2. EV Battery & Power Electronics Monitoring
3. Precision Instrumentation & Strain Measurement
4. High precision current sensor
5. Semiconductor processing: Advanced Packaging Metrology, fan-out packaging and redistribution layer (RDL) integration.
6. Optical & Precision Systems
7. Aerospace & High-Reliability Engineering
   

Designing systems where dimensional drift is not acceptable?

Contact us to discuss Ultra-High Modulus & Ultra-Low CTE PI Film (PIU) solutions tailored for your precision requirements, thermal environment, and reliability targets.