Ultra High Thermally Conductive PI Film - For Maximum Heat Dissipation in High-Power Systems

Ultra High Thermal Conductivity Polyimide Film (PMT) - for Maximum Heat Dissipation in High-Power Systems

Product Description: 

PMT is an advanced, next-generation thermally conductive polyimide film engineered for high-performance thermal management applications. It delivers approximately four times higher thermal conductivity than our standard polyimide films, while retaining the strong mechanical strength, dielectric performance, and chemical resistance inherent to polyimide materials. 

Through optimized dispersion of thermally conductive fillers within our proven PI matrix, PMT achieves a thermal conductivity of ≥ 0.8 W/m·K or even higher, enabling efficient heat transfer both in-plane and through-plane. This makes PMT an effective solution for controlling and managing localized heat accumulation in compact, high-power electronic systems.  

By combining thermal conductivity, mechanical stability, and electrical insulation, PMT supports the improved efficiency, reliability, and service life of electronic, electrical, and automotive systems where effective heat dissipation is critical. Therefore, our PMT film can be widely used as an optimal and reliable thermal management solution for applications including high-power IC interfaces, EV/HEV charging systems, motor stator slot insulation, lithium-ion battery modules, transformers, and power supplies.in electronic, electrical, and automotive industries.

Key Proterties and Benefits:

1. Ultra-High Thermal Conductivity ≧ 0.8 W/m·K
2. Excellent Dielectric Strength.  
3. High Mechanical Stability and Toughness.
4. Strong electrical resistance.
5. Outstanding thermal and chemical resistance.
6. Exceptional long-term durability and reliability.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
8. UL 94 V-0 , VTM-0 Certified.

Design Challenges in High Power Density Systems:

Engineers working on high power density systems commonly face the following challenges:

• Localized overheating due to insufficient heat conduction

• Limited Z-height preventing thicker thermal solutions

• Conflicts between thermal conductivity and electrical insulation

• Dielectric safety concerns near high-voltage components

• Thermal performance degradation under continuous operation

In many cases, thermal issues arise not from the heat source, but from insulation layers becoming unintended thermal bottlenecks.

Our Ultra-High Thermal Conductivity PI Film (PMT) Approach: 

Ultra-High Thermally Conductive Polyimide Film PMT is engineered as a functional thermal-insulating film, designed to actively participate in heat management while maintaining electrical safety, featuring:

• Ultra-high thermal conductivity
  Efficiently conducting heat away from power devices and hot spots

• High dielectric strength
  Ensuring reliable electrical insulation in high-voltage and power applications

• Thin and uniform film structure
  Supporting compact designs without increasing stack-up thickness

• Thermally stable PI matrix
  Maintaining consistent performance under continuous thermal load and thermal cycling

Unlike conventional PI films, PMT is designed to transfer heat without sacrificing insulation integrity.

Why Choose PMT for Advanced Thermal Interface Solution - 

Thermal Interface Material Design Trade-Offs

Comparing PMT with common TIM solutions in thermal conductivity, electrical insulation, conformity, and long-term reliability.

Each thermal interface solution represents a different balance among thermal conductivity, electrical insulation, conformity, and long-term reliability. PMT is positioned to address applications requiring both effective heat transfer and electrical insulation.

Available Sizes:

Film Thickness: 25µm,38µm, 50µm, 75µm

Roll Width: 520mm, 1040mm

Typical Applications:

1. High Power Devices heat dissipation insulation pads (High Power IGBT/SiC - PMT interfaces - Heat Sink), TIMs.  
2. Lithium-ion battery cell & Inter-cell insulation and thermal diffusion layers.
3. EV/HEV Inverter and High-Power charging system.
4. EV/HEV Electric motor stator slot insulation liners.
5. Converter, DC-DC Power Module and Transformer. 
6. Flexible Heaters for EV Battery.
7. Lightweight replacement solution for ceramic insulation boards.
8. Power supply insulation layers.

Application Cases:

I. High Thermal Conductivity Polyimide (PI) Film TIM Solutions for High-Power Electronics

High Thermal Conductivity Polyimide (PI) Film TIM Solutions provide efficient heat transfer with electrical insulation for high-power CPU, GPU, IC and power electronics applications.

II. PMT-Based Interface for EV SiC Power Modules

Ultra-High Thermal Conductivity PI Film (PMT) is applied at the critical interface between SiC power modules and the cooling system, reducing thermal resistance, lowering junction temperature, and enabling stable, high-efficiency operation in advanced EV powertrains.

III. Flexible Heaters Powered by PMT : Enabling Controlled and Uniform Heat Distribution

Compared to conventional PI heaters, PMT-integrated structures improve thermal spreading, reduce temperature gradients, and enhance operational stability.

IV. PMT-Based Composite Slot Liner for EV Motors

PMT-based composite slot liner integrates high dielectric insulation with enhanced thermal conduction, reducing winding temperature, improving efficiency, and extending motor lifetime in EV traction systems.

Designing high-power systems requiring both efficient heat transfer and strong electrical insulation?

Contact us to discuss Ultra-High Thermal Conductivity PI Film (PMT) solutions tailored for your thermal load, voltage requirements, and integration constraints.