Precision Die-Cut PI Thermal Interface Sheet (TIS)- for Accurate Fit, High Thermal Conductivity, and Electrical Insulation

Die-Cut Polyimide Thermal Interface Sheet (TIS) - Engineered for Accurate Fit, High Thermal Conductivity, and Electrical Insulation

Product Description: 

Die-Cut Polyimide Thermal Interface Sheet (TIS) is a high-performance thermal interface and electrical insulation solution engineered for demanding power electronics and electrical system designs. It delivers efficient heat dissipation, excellent dielectric strength, and precise dimensional accuracy to ensure stable and reliable operation under high voltage and high temperature conditions.

TIS is constructed using our standard or ultra high thermally conductive polyimide film as the basic carrier laminated with high-performance pressure-sensitive silicone adhesive, acrylic adhesive, or thermally conductive PSA. The composite structure is then precision die-cut using high-accuracy punching equipment to ensure tight tolerances, clean edges, and burr-free profiles for consistent assembly quality. 

By combining high thermal conductivity with robust electrical insulation, TIS ensures reliable insulation coverage, stable thermal contact, and long-term voltage reliability in transformers, motors, inverters, DC–DC converters, battery chargers, and isolators. Its thin yet tough structure makes it especially suitable for applications requiring efficient heat transfer without compromising electrical safety or space constraints.

Key Proterties: 

1. Efficient Thermal Interface Management (TIM) : Optimized to minimize interfacial thermal resistance, enabling efficient heat transfer between heat sources and heat sinks for improved thermal performance and system reliability.
2. High Thermal Conductivity (>0.8 W/m·K) : Ensures fast and efficient heat transfer across interfaces, reducing heat buildup and improving reliability in demanding thermal management applications.
3. Excellent Electrical Insulation & High Dielectric Strength (>120KV/mm): Ultra-high dielectric strength ensures reliable electrical isolation under high voltage, preventing leakage, breakdown, and short circuits.
4. Precision Lamination & Die-Cutting Processes: Clean edges and tight tolerances suitable for complex DCC/HCC Power devices and MOSFET devices.
5. High Dimensional Accuracy: Tight tolerance up to ±0.05 mm.
6. Environmental Durability: Resistant to radiation, solvents, and harsh operating environments.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.

Die-Cut PI Thermal Interface Sheet (TIS) Structure: 

Design Challenges in High-Power Systems:

High-power electronics generate significant heat while requiring strict electrical isolation. Designers must balance thermal performance, insulation reliability, and mechanical stability within limited space and tight tolerances.

Key challenges include:

• Thermal bottleneck between power module and heatsink

• Electrical isolation vs. heat dissipation trade-off

• Interface resistance from imperfect contact surfaces

• Assembly tolerance control and alignment accuracy

• Long-term reliability under thermal cycling and high load conditions

In many cases, thermal performance issues originate not from the heat source itself, but from improper interface material behavior or dimensional mismatch.

Our Precision PI Thermal Interface Pads (TIS) Approach: 

Our TIS solutions are engineered with equal emphasis on thermal performance, electrical safety, and mechanical precision, featuring:

• High thermal conductivity PI film integration
  Efficiently transferring heat away from heat-generating components

• High dielectric insulation performance
  Supporting safe operation in power and high-voltage environments

• Perforated design (for DCC applications)                                                                                                                                   Enables optimized heat flow paths through interface materials (e.g., grease/TIM)

• Precision die-cut geometry 
  Ensuring accurate fit, clean edges, and repeatable placement

• Controlled thickness & uniform lamination
  Delivers consistent thermal performance across the interface

• High-quality inspection                                                                                                                                                           Guarantees dimensional accuracy and defect-free appearance

Unlike generic thermal pads, TIS is designed as a precision interface component, not just a filler layer.

High-Precision Manufacturing & Inspection for TIS

A complete precision workflow—from roll-to-roll lamination to high-accuracy die cutting and inspection—ensuring tight tolerances, clean edges, and reliable quality for high-performance thermal insulation solutions.

Available Sizes & Shapes: 

Our TIS materials are available in multiple high thermal conductivity PI film thicknesses (1 to 5 mil) and PSA options (10 to 60 μm), with precision die-cutting for customized sizes and complex geometries, ensuring design flexibility, clean edges, and consistent quality.

Typical Applications: 

1. DCC Power Modules                                                                                                                                                                        Thermal and electrical interface between power substrate and heatsink
2. High-Power MOSFET & IGBT Devices                                                                                                                                            Insulation pads for reliable heat dissipation and electrical isolation
3. Power Conversion Systems                                                                                                                                                        Inverters, converters, and power control units requiring stable thermal management
4. EV Battery BMS                                                                                                                                                                              Electrical insulation and localized heat management for stable and reliable BMS operation
5. Industrial Power Electronics                                                                                                                                                             High-current systems demanding efficient heat transfer and long-term reliability
6. LED & High-Power Lighting Modules                                                                                                                                          Thermal interface for heat-sensitive components

Application Cases: 

I. Die-Cut PI Thermal Conductivity Interface Sheet (TIS) for DCC Power Modules

Our perforated TIS (High Thermal Conductivity Insulation Solution) is engineered to sit between the DCC power module and heatsink, delivering reliable electrical insulation while enabling efficient heat transfer. Designed for high-power applications, it ensures stable thermal performance, tight tolerances, and long-term reliability.

II. Precision PI Thermal Interface Sheet (TIS) for High-Power MOSFET Applications

Engineered for reliable insulation and efficient heat transfer, our TIS enables stable, high-performance MOSFET operation with precision die-cut quality and consistent interface control.

III. High-Precision PI Thermal interface sheet (TIS) for  EV Battery BMS Applications

Engineered for EV battery systems, our TIS delivers reliable insulation and efficient heat transfer to support stable and safe BMS operation.

Designing products requiring both high thermal conductivity and electrical insulation?

Contact us to discuss Precision Die-Cut PI Thermal Interface Sheet (TIS) solutions tailored to your thermal load, insulation requirements, and assembly constraints.