High Performance Thermally Conductive PI Film - For Balanced Thermal & Insulation Performance

High Thermal Conductivity Polyimide Film (PIT) - For Balanced Thermal & Insulation Performance

Product Description:

High Thermally Conductive Polyimide Film (PIT) is engineered to solve one of today’s most critical challenges in electronic design—efficient heat dissipation without sacrificing electrical insulation or mechanical reliability. Unlike standard polyimide films that act as thermal barriers, PIT serves as a thermal highway. It effectively pulls heat away from sensitive components while maintaining excellent dielectric strength and long-term durability. This unique balance enables higher power density, improved reliability, and longer service life in compact and high-temperature environments.

With a thermal conductivity of ≥ 0.4 W/m·K, PIT significantly enhances thermal performance in electrical and electronic assemblies such as power converters, transformers, heat-sink pads, power supplies, LED/OLED flexible circuits, and EV/HEV motor slot insulation systems. It is an advanced alternative to traditional laminated insulation materials such as NKN or DMD, offering improved flexibility, lighter weight, and design freedom. 　

Key Features and Benefits:

1. High Thermal Conductivity: ≥ 0.4 W/m·K for efficient heat dissipation.
2. Excellent Electrical Insulation: High dielectric strength and electrical resistance.
3. Mechanical Toughness: Maintains stability under thermal cycling and stress.
4. Chemical Resistance: Withstands harsh processing and operating environments.
5. High Durability: Long service life with excellent reliability.
6. Design Flexibility: Thin, lightweight solution for compact assemblies.
7. RoHS & REACH SVHC compliant, meeting all current EU environment mandates.
8. UL 94 V-0 , VTM-0 Certified.

Design Challenges in Thin Thermal Management Structures

Engineers designing thin, power-dense systems commonly face:

• Heat accumulation caused by low-conductivity insulation layers

• Limited Z-height preventing thicker thermal interface materials

• Conflicts between thermal performance and electrical safety

• Local hot spots degrading reliability and performance

• Over-reliance on downstream heat sinks to solve upstream thermal bottlenecks

In many cases, thermal issues originate not from heat generation, but from insulation layers unintentionally blocking heat flow.

Our High Thermal Conductivity PIT Film Approach

Our High Thermal Condcutivity PIT Film is engineered as a thermally functional insulation film, designed to participate actively in heat transfer while preserving electrical reliability, featuring:

• High thermal conductivity (≥0.4 W/m·K)
  Improving heat transfer efficiency compared to conventional PI films

• High dielectric strength
  Ensuring electrical insulation in power and mixed-signal environments

• Thin and uniform film structure
  Supporting compact designs without increasing stack-up thickness

• Thermally stable PI matrix
  Maintaining consistent performance under continuous operation and thermal cycling

Unlike general-purpose PI films, PIT is designed to be part of the thermal architecture, not just a protective barrier.

How to use PIT in Thermal Management Systems

Our High Thermal Conductivity PIT film is typically integrated as:

• A primary heat-conducting insulation layer beneath heat-generating components

• A thermal transfer layer between active devices and thermal interface materials (TIM)

• A thin thermal insulation layer in compact power and electronic modules

PIT integrates within the TIM layer to spread and transfer heat efficiently, offering flexible thermal design options with or without a heat spreader.

Available Sizes:

Film Thickness: 25µm,38µm, 50µm, 75µm, 100µm,125µm

Roll Width: 300mm, 600mm

Typical Applications:

1. High Power Modules & Power Electronics
2. Automotive Electronics & Control Units
3. Compact Electronic Modules with Limited Z-Height
4. EV / HEV motor slot insulation liners (NKN / DMD replacement).
5. Sensor, Camera, and Mixed-Signal Modules
6. Thermal Stack-Up Designs Combined with TIM or Heat Sinks
7. General Electronics Requiring Balanced Thermal & Electrical Performance

Application Case: 

I. PIT Thermal Interface Solution for PMIC Heat Management

PIT (Polyimide-based Thermal Interface) enables efficient heat transfer from PMIC devices to the heat sink, reducing interface resistance, eliminating hotspots, and improving power stability in high-density electronics.

Designing systems where insulation must also conduct heat?

Contact us to discuss High Thermal Conductivity PI Film (PIT) solutions optimized for your thermal load, electrical requirements, and space constraints.