Black & Opaque Polyimide Film Coverlay (BPC) is composed of our highly uniform black polyimide film (matte or glossy type) pre-laminated with a high heat-resistant thermosetting epoxy adhesive (TSA, room temperature type), providing an excellent balance of good initial adhesion (quick stick) and good shear holding power. It delivers precise dimensional stability, controlled CTE, strong adhesion, and resistance to delamination between layers. It is engineered for applications requiring effective light blocking, a uniform black appearance, and excellent thermal and chemical resistance.
Designed to withstand repeated bending, flexing, mechanical stress, and electrical loads, BPC maintains excellent dielectric performance under extreme conditions. It is fully compatible with SMT assembly, solder reflow, and other high-temperature processing steps, ensuring high process reliability without cracking, warping, or loss of insulation.
Serving as a flexible solder mask alternative, BPC encapsulates copper circuits and protects them from moisture, abrasion, chemicals, and thermal stress, making it suitable for high-reliability flexible electronic applications, including FPCs, Flexible Heater, Automotive Samrt & Heated Laminated glass interconnect, ADAS cameras & sensors.
Unlike traditional PI coverlay materials that require frozen or refrigerated storage, BPC is designed for convenient ambient-temperature storage and transportation. This eliminates cold-chain handling requirements—reducing logistics costs and simplifying inventory management for global customers.
When standard transparent or semi-transparent coverlays are used in light-sensitive applications, engineers often encounter:
Optical leakage affecting sensors, cameras, or photodetectors
Increased noise or signal instability caused by stray light
Limited ability to control optical paths within compact modules
Trade-offs between insulation requirements and optical shielding
Additional shielding layers increasing thickness and complexity
These issues often force engineers to add secondary light-blocking structures, increasing design complexity and cost.
BPC PI Coverlay is engineered to address optical interference at the material level, featuring:
Black & opaque polyimide construction
Effectively blocking visible and stray light penetration
Integrated insulation and light shielding
Eliminating the need for additional optical blocking layers
Compatibility with FPC and circuit board layouts
Supporting compact designs without excessive stack-up thickness
Stable performance under assembly and harsh operating conditions
Maintaining optical shielding effectiveness throughout product life
By integrating optical shielding directly into the coverlay layer, BPC enables simpler, cleaner, and more reliable circuit designs.
Black PI coverlay performance depends on surface finish: while glossy black PI blocks light but still reflects, matte black PI (BPC) absorbs light and minimizes reflection, ensuring stable signal integrity.
Black PI Coverlay (BPC) supports stable and durable heated windshield operation by protecting critical heating circuits and bonding interfaces, ensuring consistent and efficient de-icing performance under harsh automotive conditions.
Illustration of a flexible heater protected by Black PI Coverlay (BPC), showing the protective insulation layer partially peeled back to reveal etched copper circuit patterns.
Example of flexible copper clad laminate (FCCL) manufactured by laminating copper foil onto our Black PI Coverlay (BPC), providing excellent electrical insulation, mechanical strength, and thermal stability for flexible printed circuit applications.
Contact us to discuss BPC PI Coverlay solutions optimized for your optical shielding and circuit design needs.
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